Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy may be absorbed and converted to excessive heat — degrading both the process (lost RF energy) and components (excess heat and thermal gradients).
ADVANCED CERAMIC COMPONENTS
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.
EXAMPLE ETCH PROCESS MATERIALS
Plasma Pure™ UC Alumina
Low Loss Tangent Alumina
PureSiC® CVD Silicon Carbide
Exyria™ Yttria & Yttria Coatings
Coatings: CVD SiC, ESD-Safe
UltraClean™ Recrystallized SiC
StatSafe™ ESD-Safe Ceramics
Single Crystal Silicon
Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy may be absorbed and converted to excessive heat — degrading both the process (lost RF energy) and components (excess heat and thermal gradients).
ADVANCED CERAMIC COMPONENTS
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.
EXAMPLE ETCH PROCESS MATERIALS
- Plasma Pure™ UC Alumina
- Low Loss Tangent Alumina
- PureSiC® CVD Silicon Carbide
- Exyria™ Yttria & Yttria Coatings
- Coatings: CVD SiC, ESD-Safe
- UltraClean™ Recrystallized SiC
- StatSafe™ ESD-Safe Ceramics
- Single Crystal Silicon
