CoorsTek Ceramic Epoxy Seal Lids

Description
CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles —delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages. Precision Ceramic Components for Microelectronic Applications Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial equipment, and consumer appliances.
Description
CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles —delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages. Precision Ceramic Components for Microelectronic Applications Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial equipment, and consumer appliances.

Suppliers

Company
Product
Description
Supplier Links
Ceramic Epoxy Seal Lids -  - CoorsTek
Golden, CO, USA
Ceramic Epoxy Seal Lids
Ceramic Epoxy Seal Lids
CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles —delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages. Precision Ceramic Components for Microelectronic Applications Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial equipment, and consumer appliances.

CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles —delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages.

Precision Ceramic Components for Microelectronic Applications

Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial equipment, and consumer appliances.

Supplier's Site

Technical Specifications

  CoorsTek
Product Category Industrial Ceramic Materials
Product Name Ceramic Epoxy Seal Lids
Shape / Form Custom Shape
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