CoorsTek Ceramic Chamber Lids for Deposition Chambers

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Ceramic Chamber Lids for Deposition Chambers -  - CoorsTek
Golden, CO, USA
Ceramic Chamber Lids for Deposition Chambers
Chamber domes (sometimes referred to as lids) are used to create a clean, inert, and protected environment in deposition chambers. Chemical reactions inside the chamber deposit thin layers of metallic, dielectric, or semiconductive material onto the wafers. Chamber lids and liners are exposed to plasma during deposition or etch processes — requiring a combination of high plasma durability, purity, and dielectric strength. High-purity alumina (Al2O3) and aluminum nitride (AlN) are frequently used to meet these equipment challenges. SEMICONDUCTOR DEPOSITION PROCESSING Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides custom engineered OEM components for: Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Electrochemical Plating / Electrochemical Deposition (ECP, ECD) Atomic Layer Deposition (ALD)
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Technical Specifications

  CoorsTek
Product Category Specialty Ceramics
Product Number
Product Name Ceramic Chamber Lids for Deposition Chambers
Applications Chemical or material processing
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