CoorsTek developed the standards for thick-film and thin-film substrates and continues to lead the market with innovative materials, manufacturing, and secondary processes. Customers rely on us for cost-effective solutions delivered on time.
Aluminum Nitride Advantages
High heat dissipation with thermal conductivity of 170 W/m K
Non-toxic alternative to BeO
Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
High dielectric strength
CoorsTek developed the standards for thick-film and thin-film substrates and continues to lead the market with innovative materials, manufacturing, and secondary processes. Customers rely on us for cost-effective solutions delivered on time.
Aluminum Nitride Advantages
- High heat dissipation with thermal conductivity of 170 W/m K
- Non-toxic alternative to BeO
- Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
- High dielectric strength
