CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics.
Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.
MIDFILM® SUBSTRATES
CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.
| CoorsTek | |
|---|---|
| Product Category | Industrial Ceramic Materials |
| Product Number | ADS-995R |
| Product Name | Mid-Film Ceramic Electronic Substrates |
| Material Type | Alumina |
| Composition | 99.5% Alumina |
| Applications | Electronics or semiconductors |
| Thermal Conductivity | 31 W/m-K (17.91 BTU-ft/hr-ft²-F) |
