CoorsTek Mid-Film Ceramic Electronic Substrates ADS-995R

Description
CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications. MIDFILM® SUBSTRATES CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.
  • Mid-Film Ceramic Electronic Substrates - ADS-995R - CoorsTek
    CoorsTek
Datasheet
Description
CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications. MIDFILM® SUBSTRATES CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.
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Mid-Film Ceramic Electronic Substrates - ADS-995R - CoorsTek
CoorsTek
Golden, CO, USA
Mid-Film Ceramic Electronic Substrates
ADS-995R
Mid-Film Ceramic Electronic Substrates ADS-995R
CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications. MIDFILM® SUBSTRATES CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.

CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics.

Why Ceramic Thick-Film Substrates?

Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.

MIDFILM® SUBSTRATES

CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.

Supplier's Site Datasheet

Technical Specifications

  CoorsTek
Product Category Industrial Ceramic Materials
Product Number ADS-995R
Product Name Mid-Film Ceramic Electronic Substrates
Material Type Alumina
Composition 99.5% Alumina
Applications Electronics or semiconductors
Thermal Conductivity 31 W/m-K (17.91 BTU-ft/hr-ft²-F)
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