The design and modeling of microscale electro-mechanical systems (MEMS) is a unique engineering discipline. At small length scales, designs must consider the effects of several physical phenomena. For example: electromagnetic-stru
ctural, thermal-structural, and fluid-structural interactions (FSI) are typical issues in the design of resonators, sensors, actuators, piezoelectric, and microfluidics systems.
The MEMS Module solves problems that couple structural mechanics, microfluidics, and electromagnetics. These physics can be solved individually, or in any arbitrary combination. Special formulations exist for electrostatic actuation, piezoelectrics, microfluidics, thin film damping, FSI, joule heating with thermal expansion, two-phase flow, and others. Lumped parameter extraction and connection to external electrical circuits via SPICE netlist is made easy. Built upon the core capabilities of COMSOL Multiphysics, the MEMS Module can be used to address almost all simulations in the microscale domain.