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Components Corporation Free-Standing Card Edge Interconnect System DIGI-KLIP High Performance

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Free-Standing Card Edge Interconnect System - DIGI-KLIP High Performance - Components Corporation
Denville, NJ, USA
Free-Standing Card Edge Interconnect System
DIGI-KLIP High Performance
Free-Standing Card Edge Interconnect System DIGI-KLIP High Performance
The patented DIGI-KLIP®, free-standing card edge interconnect system is based upon a unique contact principle, distinctive from traditional methods of connector fabrication. The DIGI-KLIP® contact is formed from soft beryllium copper alloy wire and heat treated after forming, while typical card edge contacts are progressive die stamped from mill-hardened strip stock. Significant advantages in contact structure and performance result from this manufacturing process. Post forming heat treatment utilizes the full potential of the beryllium copper alloy in optimizing the spring temper of the contact and enhancing its ability to withstand stress relaxation. Due to the forming of the contact profile from soft material, relatively small bend radii may be employed while alloying for a very compact overall design which provides space savings and an extremely short signal path. Additionally, the DIGI-KLIP® contact point provides a "ball" type footprint. This feature insures an extremely high unit pressure at the mating junction which guarantees a "gas tight" interconnect while offering a true "wiping action" contact. This capability is of particular advantage in today's high speed, low level switching environments. In these critical applications, the most minute presence of surface oxides, film or contamination can result in loss of signal or contact disruption.

The patented DIGI-KLIP®, free-standing card edge interconnect system is based upon a unique contact principle, distinctive from traditional methods of connector fabrication. The DIGI-KLIP® contact is formed from soft beryllium copper alloy wire and heat treated after forming, while typical card edge contacts are progressive die stamped from mill-hardened strip stock.

Significant advantages in contact structure and performance result from this manufacturing process. Post forming heat treatment utilizes the full potential of the beryllium copper alloy in optimizing the spring temper of the contact and enhancing its ability to withstand stress relaxation. Due to the forming of the contact profile from soft material, relatively small bend radii may be employed while alloying for a very compact overall design which provides space savings and an extremely short signal path.

Additionally, the DIGI-KLIP® contact point provides a "ball" type footprint. This feature insures an extremely high unit pressure at the mating junction which guarantees a "gas tight" interconnect while offering a true "wiping action" contact. This capability is of particular advantage in today's high speed, low level switching environments. In these critical applications, the most minute presence of surface oxides, film or contamination can result in loss of signal or contact disruption.

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Technical Specifications

  Components Corporation
Product Category Board Mount Connectors
Product Number DIGI-KLIP High Performance
Product Name Free-Standing Card Edge Interconnect System
Category Board to Board Connector; Card Edge Connector
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