Designed to bond together structural materials such as Metapor, aluminum, ceramics and a wide variety of metals and substrates.
Used to manufacture molds larger than stock sizes by joining plates of Metapor or aluminum together.
Handles higher than normal temperature (250°F) and aggressiveenvironmen
ts typically found in thermoforming.
Won't degrade under stressful thermoforming conditions.
Designed to bond together structural materials such as Metapor, aluminum, ceramics and a wide variety of metals and substrates.
Used to manufacture molds larger than stock sizes by joining plates of Metapor or aluminum together.
Handles higher than normal temperature (250°F) and aggressiveenvironmen
ts typically found in thermoforming.
Won't degrade under stressful thermoforming conditions.
Designed to bond together structural materials such as Metapor, aluminum, ceramics and a wide variety of metals and substrates.
Used to manufacture molds larger than stock sizes by joining plates of Metapor or aluminum together.
Handles higher than normal temperature (250°F) and aggressiveenvironments typically found in thermoforming.
Won't degrade under stressful thermoforming conditions.
