Chip Quik, Inc. Solder TS991AX500T4

Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Request a Quote Datasheet
Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 315-TS991AX500T4-ND - DigiKey
Thief River Falls, MN, United States
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number 315-TS991AX500T4-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 2013550 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Aluminum TIG Rod -  - Detroit Torch & Mfg. Co.
Detroit Torch & Mfg. Co.
Specs
Joining Process / Product Form Rod
Welding Filler Types Aluminum
Weld Positions All positions
View Details
Bare Wire - Universal Ti-7 and Ti-0.2Pd - Universal Wire Works Inc.
Specs
Joining Process / Product Form Solid wire or rod
Welding Filler Types Titanium Alloy
Approvals / Conformance AWS
View Details