Chip Quik, Inc. Solder TS391SNL250

Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
  • Solder - TS391SNL250-ND - DigiKey
    DigiKey
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Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - TS391SNL250-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Solder
TS391SNL250-ND
Solder TS391SNL250-ND
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

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Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number TS391SNL250-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
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