Chip Quik, Inc. Solder TS391SNL250

Name: Solder
Brand: Chip Quik, Inc.

Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

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Thief River Falls, MN, United States

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

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Datasheet

	DigiKey
Product Category	Filler Alloys and Consumables
Product Number	TS391SNL250-ND
Product Name	Solder
Joining Process / Product Form	Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

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MacDermid Alpha Electronics Solutions

Specs

Fluxes & Cleaners Soldering Flux / Rosin

RS Components, Ltd.

Specs

Joining Process / Product Form Solid wire or rod

Diameter / Thickness 0.0157 inch (0.4000 mm)

Melting Range 361 to 370 F (183 to 188 C)

Henkel Corporation - Industrial

Specs

Joining Process / Product Form Braze or solder in the form of a paste.; Paste

Henkel Corporation - Electronics