Chip Quik, Inc. Solder SMDSWLF.031 1OZ

Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 oz (28.35g)
Request a Quote Datasheet
Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 oz (28.35g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMDSWLF.0311OZ-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 oz (28.35g)

Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 oz (28.35g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMDSWLF.0311OZ-ND
Product Name Solder
Joining Process / Product Form Solid wire or rod; Spool, 1 oz (28.35g)
Unlock Full Specs
to access all available technical data

Similar Products

Printed Circuit Board (PCB) Solder Stencils - ALPHA ® CUT HR2 Laser Cut Stencils - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details
Solder - 555238 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Braze or solder in the form of a paste.; Paste
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
Arc Weld Stud - No Thread -  - Southern Stud Weld, Inc.
Southern Stud Weld, Inc.
Specs
Joining Process / Product Form Weld Stud or Nut
Diameter / Thickness 0.1870 to 1 inch (4.75 to 25.4 mm)
Tensile Strength (UTS) 60000 psi (42227 m H2O)
View Details
Resistance Welding Composites -  - Mi-Tech Metals
Specs
Applications / Materials Joined Die Inserts And Electrode Facings
Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing
Nominal Composition Tungsten With Copper Or Silver
View Details