Chip Quik, Inc. Solder SMDSW.031 2OZ

Description

Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 2 oz (56.70g)

DigiKey

Request a Quote

Email Supplier

Datasheet

Description

Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 2 oz (56.70g)

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

DigiKey

Thief River Falls, MN, United States

Solder
SMDSW.0312OZ-ND

Solder SMDSW.0312OZ-ND

Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 2 oz (56.70g)

Buy Now

Datasheet

Technical Specifications

	DigiKey
Product Category	Filler Alloys and Consumables
Product Number	SMDSW.0312OZ-ND
Product Name	Solder
Joining Process / Product Form	Solid wire or rod; Spool, 2 oz (56.70g)

Unlock Full Specs

to access all available technical data

Similar Products

MacDermid Alpha Electronics Solutions

Silver Sintering Package Attach for Semiconductor Power Modules

ALPHA ® Argomax ® 5022 Paste

Specs

Joining Process / Product Form Braze or solder in the form of a paste.

View Details

RS Components, Ltd.

Solder

555222

Specs

Joining Process / Product Form Powder; Granules

Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)

Approvals / Conformance RoHS Compliant

View Details

Southern Stud Weld, Inc.

CD Weld Stud Brass Series

Specs

Joining Process / Product Form Weld Stud or Nut

Diameter / Thickness 0.0860 to 0.3750 inch (2.18 to 9.52 mm)

Tensile Strength (UTS) 60000 psi (42227 m H2O)

View Details

Mi-Tech Metals

Resistance Welding Composites

Specs

Applications / Materials Joined Die Inserts And Electrode Facings

Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing

Nominal Composition Tungsten With Copper Or Silver

View Details