Chip Quik, Inc. Solder SMDLTLFP60T4

Description
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g)
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMDLTLFP60T4-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g)

Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMDLTLFP60T4-ND
Product Name Solder
Joining Process / Product Form Jar, 2.12 oz (60g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 1796658 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0276 inch (0.7000 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
ALPHA ® 870-25 Liquid Soldering Flux -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Melt-Spun Foil Icronibsi®-7 (AMS-4777) -  - Morgan Advanced Materials
Specs
Joining Process / Product Form Strip, sheet or foil
Melting Range 1176 to 1875 F (636 to 1024 C)
View Details
Rope Hardfacing Flexible Cord - Grade N Tuf-Cote® - Saint-Gobain Coating Solutions
Specs
Joining Process / Product Form A multi-layered preform for brazing carbide or joining materials with compatibility issues.
Braze Alloy Nickel Alloy Braze; Tungsten Carbide
View Details