Chip Quik, Inc. Solder SMDLTLFP500T3C

Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)
  • Solder - SMDLTLFP500T3C-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMDLTLFP500T3C-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Solder
SMDLTLFP500T3C-ND
Solder SMDLTLFP500T3C-ND
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMDLTLFP500T3C-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Cartridge, 17.64 oz (500g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 7568887 - RS Components, Ltd.
RS Components, Ltd.
Solder
7568887
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0150 inch (0.3800 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Innolot ® Power Electronics - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Innolot ® Power Electronics
View Details
PrintPlus® Printing Paste - - Nordson EFD
Nordson EFD
PrintPlus® Printing Paste
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details
Nickel Pre-Cut Tabs - - Sunstone Engineering
Sunstone Engineering
Nickel Pre-Cut Tabs
Specs
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
Welding Filler Types Nickel Alloy
View Details