Chip Quik, Inc. Solder SMDLTLFP250T4

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

DigiKey

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Datasheet

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

DigiKey

Thief River Falls, MN, United States

Solder
SMDLTLFP250T4-ND

Solder SMDLTLFP250T4-ND

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

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Datasheet

Technical Specifications

	DigiKey
Product Category	Filler Alloys and Consumables
Product Number	SMDLTLFP250T4-ND
Product Name	Solder
Joining Process / Product Form	Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

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