Chip Quik, Inc. Solder Paste, Sn, Bi, Ag, 138Deg C, 15G; Flux Type Chip Quik SMDLTLFP15T4

Solder Paste Sn42/Bi57.6/Ag0.4 is a no-clean solder paste designed for high-performance applications. It features a melting point of 138¬8C and comes in a 15g packaging. The product has a metal load of 87% by weight and is classified as REL0 for flux type. It is compliant with RoHS II and REACH regulations, ensuring it meets environmental standards. The paste is suitable for printing speeds of up to 100mm/sec and offers a long stencil life, with over 8 hours at 20-50% relative humidity. The shelf life is two years when stored unrefrigerated before mixing, and six months when refrigerated after mixing. The product requires mixing before use and can be stored in a provided jar after opening. It is compatible with most board finishes and has been tested for various performance metrics, including corrosion resistance and surface insulation resistance.