Chip Quik, Inc. Solder SMDLTLFP

Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMDLTLFP-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMDLTLFP-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
Unlock Full Specs
to access all available technical data

Similar Products

Low and No-Silver Lead Free Alloys SACX Plus 0307, SACX Plus 0807 -  - MacDermid Alpha Electronics Solutions
Specs
Solder Alloy Lead Free
View Details
Solder - 1335607 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0197 inch (0.5000 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Gas-Shielded Wires, Low Alloy - S278915-002 - Hobart Brothers, an ITW Company
Hobart Brothers, an ITW Company
Specs
Joining Process / Product Form Hollow wire or metal cored filler
Diameter / Thickness 0.0520 inch (1.32 mm)
Welding Filler Types Steel - Low Alloy Carbon
View Details
Solder Ribbon - Tin-Lead Ribbon - 63Sn 37Pb - Indium Corporation
Specs
Joining Process / Product Form Strip, sheet or foil
Diameter / Thickness 0.0020 inch (0.0508 mm)
Nominal Composition 63Sn-37Pb
View Details