Chip Quik, Inc. Solder SMD4300SNL250T5

Description

Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

DigiKey

Request a Quote

Email Supplier

Datasheet

Description

Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

DigiKey

Thief River Falls, MN, United States

Solder
SMD4300SNL250T5-ND

Solder SMD4300SNL250T5-ND

Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Buy Now

Datasheet

Technical Specifications

	DigiKey
Product Category	Filler Alloys and Consumables
Product Number	SMD4300SNL250T5-ND
Product Name	Solder
Joining Process / Product Form	Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

Unlock Full Specs

to access all available technical data

Similar Products

RS Components, Ltd.

Solder

4203118

Specs

Joining Process / Product Form Solid wire or rod; Wire

Diameter / Thickness 0.0295 inch (0.7500 mm)

Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)

View Details

MacDermid Alpha Electronics Solutions

Cored Solder Wire for Electronics

ALPHA ® Telecore XL-825 Cored Wire

Specs

Joining Process / Product Form Flux Cored Wire

View Details

Morgan Advanced Materials

Precious Brazing Filler Metal Orotin™

Specs

Joining Process / Product Form Braze or solder in the form of a paste. (optional feature); Powder (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)

Melting Range 536 F (280 C)

View Details

Lincoln Electric Co. (The)

Welding Consumable - Submerged Arc

Lincolnweld® LA-90

Specs

Joining Process / Product Form Submerged Arc (SAW) Electrode

Diameter / Thickness 0.0625 to 0.1562 inch (1.59 to 3.97 mm)

Nominal Composition 0.05-0.15 %C, 1.60-2.10 %Mn, 0.50-0.80 %Si, 0.40-0.60 %Mo, 0.025 %S, 0.025 %P, 0.35 %Cu

View Details