Chip Quik, Inc. Solder SMD2SWLF.020 2OZ

Description
Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 2 oz (56.70g)
Request a Quote Datasheet
Description
Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 2 oz (56.70g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMD2SWLF.0202OZ-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 2 oz (56.70g)

Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 2 oz (56.70g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMD2SWLF.0202OZ-ND
Product Name Solder
Joining Process / Product Form Solid wire or rod; Spool, 2 oz (56.70g)
Unlock Full Specs
to access all available technical data

Similar Products

Liquid Solder Flux - ALPHA ® NR205 Liquid Soldering Flux - MacDermid Alpha Electronics Solutions
Specs
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Solder - 7568878 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0276 inch (0.7000 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
CD Weld Stud Stainless Steel Series -  - Southern Stud Weld, Inc.
Specs
Joining Process / Product Form Weld Stud or Nut
Diameter / Thickness 0.0860 to 0.3750 inch (2.18 to 9.52 mm)
Tensile Strength (UTS) 60000 psi (42227 m H2O)
View Details
Resistance Welding Composites -  - Mi-Tech Metals
Specs
Applications / Materials Joined Die Inserts And Electrode Facings
Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing
Nominal Composition Tungsten With Copper Or Silver
View Details