Chip Quik, Inc. Solder SMD291SNL500T3

Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - SMD291SNL500T3-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number SMD291SNL500T3-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® PowerBond ® Solder Preforms-Power Electronics -  - MacDermid Alpha Electronics Solutions
Specs
Solder Alloy Lead Free
View Details
Solder - 555288 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
Engineered Solder Materials - InTEGRATED® Solder Preforms - Indium Corporation
Specs
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag); Indium Alloy Solders
View Details
CD Weld Stud Low Carbon Steel Series -  - Southern Stud Weld, Inc.
Specs
Joining Process / Product Form Weld Stud or Nut
Diameter / Thickness 0.0860 to 0.3750 inch (2.18 to 9.52 mm)
Tensile Strength (UTS) 60000 psi (42227 m H2O)
View Details