Chip Quik, Inc.
Flux, Flux Remover
NCP291-2OZ
Description
Flux - No Clean
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Datasheet
Description
Flux - No Clean
Request a Quote
Email Supplier
Datasheet
Technical Specifications
|
Product Category
|
Filler Alloys and Consumables |
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Product Number
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315-NCP291-2OZ-ND |
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Product Name
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Flux, Flux Remover |
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Joining Process / Product Form
|
Jar, 1.76 oz (50g)
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Joining Process / Product Form
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Diameter / Thickness
0.0394 inch (1 mm)
Solder Alloy
Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
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Applications / Materials Joined
Electronics, Plating, Plumbing
Joining Process / Product Form
Regular Bar
Nominal Composition
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Tensile Strength (UTS)
88037 psi (61959 m H2O)
Yield Strength (YS)
73969 psi (52058 m H2O)
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