Chip Quik, Inc. Solder NC191SNL50

Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 315-NC191SNL50-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number 315-NC191SNL50-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 1796671 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
CD Weld Stud Aluminum Alloy Series -  - Southern Stud Weld, Inc.
Specs
Joining Process / Product Form Weld Stud or Nut
Diameter / Thickness 0.0860 to 0.3750 inch (2.18 to 9.52 mm)
Tensile Strength (UTS) 60000 psi (42227 m H2O)
View Details
Resistance Welding Composites -  - Mi-Tech Metals
Specs
Applications / Materials Joined Die Inserts And Electrode Facings
Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing
Nominal Composition Tungsten With Copper Or Silver
View Details