Chip Quik, Inc. Solder NC191LT15T5

Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 315-NC191LT15T5-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number 315-NC191LT15T5-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
Unlock Full Specs
to access all available technical data

Similar Products

Cored Solder Wire for Electronics - ALPHA ® Fluitin 1532 Cored Wire - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Flux Cored Wire
View Details
Solder - 159258 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0319 inch (0.8100 mm)
Solder Alloy Tin-Silver Alloy Solder (Sn-Ag)
View Details
Arc Weld Stud - No Thread -  - Southern Stud Weld, Inc.
Southern Stud Weld, Inc.
Specs
Joining Process / Product Form Weld Stud or Nut
Diameter / Thickness 0.1870 to 1 inch (4.75 to 25.4 mm)
Tensile Strength (UTS) 60000 psi (42227 m H2O)
View Details
Resistance Welding Composites -  - Mi-Tech Metals
Specs
Applications / Materials Joined Die Inserts And Electrode Facings
Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing
Nominal Composition Tungsten With Copper Or Silver
View Details