Chip Quik, Inc. Solder NC191AX50

Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)
  • Solder - 315-NC191AX50-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 315-NC191AX50-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Solder
315-NC191AX50-ND
Solder 315-NC191AX50-ND
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number 315-NC191AX50-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® Exactalloy ® Industrial Solder Preforms - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
ALPHA ® Exactalloy ® Industrial Solder Preforms
Specs
Solder Alloy Lead Free
View Details
Solder - 7568881 - RS Components, Ltd.
RS Components, Ltd.
Solder
7568881
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0500 inch (1.27 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Low Hydrogen Electrodes - S119951-033 - Hobart Brothers, an ITW Company
Hobart Brothers, an ITW Company
Low Hydrogen Electrodes
S119951-033
Specs
Joining Process / Product Form Flux coated stick or electrode for welding or brazing.
Diameter / Thickness 0.1562 inch (3.97 mm)
Welding Filler Types Low Hydrogen Alloy
View Details
Flux-Cored Wire - Core 230 Cored Wire Solder - Indium Corporation
Indium Corporation
Flux-Cored Wire
Core 230 Cored Wire Solder
Specs
Joining Process / Product Form Flux Cored Wire
Diameter / Thickness 0.0100 to 0.0320 inch (0.2540 to 0.8128 mm)
Nominal Composition Sn95.5 Ag3.8 Cu0.7
View Details