Chip Quik, Inc. Glue, Adhesives, Applicators AD7-30S

Description
THERMOSET CHIP BONDING EPOXY (RE
  • Glue, Adhesives, Applicators - 315-AD7-30S-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
THERMOSET CHIP BONDING EPOXY (RE
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 315-AD7-30S-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
315-AD7-30S-ND
Glue, Adhesives, Applicators 315-AD7-30S-ND
THERMOSET CHIP BONDING EPOXY (RE

THERMOSET CHIP BONDING EPOXY (RE

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Adhesives
Product Number 315-AD7-30S-ND
Product Name Glue, Adhesives, Applicators
Chemical System Epoxy
Unlock Full Specs
to access all available technical data

Similar Products

Two Part Thermally Conductive, Electrically Isolating Epoxy - EP35AOLV - Master Bond, Inc.
Master Bond, Inc.
Two Part Thermally Conductive, Electrically Isolating Epoxy
EP35AOLV
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Unfilled
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Fluon® Perfluoro Adhesive
EA-2000
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Adhesives - 2484155 - RS Components, Ltd.
RS Components, Ltd.
Adhesives
2484155
Specs
Industry Encapsulation, Joints, Attaching, Sealing, Bonding, Assembly, Coating, Epoxying, Adhering
Use Temperature -40 F (-40 C)
View Details
Dymax 9102 UV-Light Cure Encapsulant Clear 30 mL MR Syringe - 9102 30ML MR SYRINGE - Ellsworth Adhesives
Dymax
Dymax 9102 UV-Light Cure Encapsulant Clear 30 mL MR Syringe
9102/30SYMR
Specs
Cure / Technology Single Component
Features Encapsulant, Potting Compound
Viscosity 17000 cP
View Details