Chemence Inc. Two Component Thermally Conductive Silicone - Low Viscosity KSC1802

KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room temperature. Alternatively, the mixed product can be exposed to a heat source of 150°C resulting in a cured elastomer in approximately 5 minutes.