KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room temperature. Alternatively, the mixed product can be exposed to a heat source of 150°C resulting in a cured elastomer in approximately 5 minutes.
| Chemence Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | KSC1802 |
| Product Name | Two Component Thermally Conductive Silicone - Low Viscosity |
| Cure / Technology | Single Component |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Metal; Plastic |
| Chemical System | Silicone |
