The CP188 process is a discontinued NPN bipolar transistor wafer process used for low-noise amplifier applications, with die dimensions of 14.6 x 14.6 mils and 9.0 mils thickness. The CP188-BC108-CT variant is a singulated bare die in waffle pack, visually inspected per MIL-STD-750. This process is no longer in production and has been replaced by the CP388X series. No electrical ratings or performance characteristics are specified for CP188-BC108-CT in the provided documentation.
Bipolar (BJT) Transistor 25V 200mA 600mW Surface Mount Die
| DigiKey | |
|---|---|
| Product Category | Transistors |
| Product Number | 1514-CP188-BC108-CT-ND |
| Product Name | Single Bipolar Transistors |
| Package Type | Die |
