Celanese Corporation HOSTAFORM HS15 2481

Description
Large gate recommended. Minimum backpressure of ~15 barr recommended. Do not exceed 230 C melt temperature.. Drying is not normally required.
  • HOSTAFORM HS15 - 2481 - Celanese Corporation
    Celanese Corporation
Description
Large gate recommended. Minimum backpressure of ~15 barr recommended. Do not exceed 230 C melt temperature.. Drying is not normally required.

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Product
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HOSTAFORM HS15 - 2481 - Celanese Corporation
Celanese Corporation
Irving, TX, USA
HOSTAFORM HS15
2481
HOSTAFORM HS15 2481
Large gate recommended. Minimum backpressure of ~15 barr recommended. Do not exceed 230 C melt temperature.. Drying is not normally required.

Large gate recommended. Minimum backpressure of ~15 barr recommended. Do not exceed 230 C melt temperature.. Drying is not normally required.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2481
Product Name HOSTAFORM HS15
Type ExtrusionGrade; MoldingCompound; Thermoplastic
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