Celanese Corporation HOSTAFORM S 9364 WS 10/1570 2449

Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.
  • HOSTAFORM S 9364 WS 10/1570 - 2449 - Celanese Corporation
    Celanese Corporation
Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM S 9364 WS 10/1570 - 2449 - Celanese Corporation
Celanese Corporation
Irving, TX, USA
HOSTAFORM S 9364 WS 10/1570
2449
HOSTAFORM S 9364 WS 10/1570 2449
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2449
Product Name HOSTAFORM S 9364 WS 10/1570
Type ExtrusionGrade; MoldingCompound; Thermoplastic
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