Celanese Corporation HOSTAFORM S 9362 2434

Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has contacted moisture through improper storage and handling or through regrind use, dry to prevent splay and odor problems.
Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has contacted moisture through improper storage and handling or through regrind use, dry to prevent splay and odor problems.

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM S 9362 - 2434 - Celanese Corporation
Irving, TX, USA
HOSTAFORM S 9362
2434
HOSTAFORM S 9362 2434
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has contacted moisture through improper storage and handling or through regrind use, dry to prevent splay and odor problems.

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has contacted moisture through improper storage and handling or through regrind use, dry to prevent splay and odor problems.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2434
Product Name HOSTAFORM S 9362
Type ExtrusionGrade; MoldingCompound; Thermoplastic
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