Celanese Corporation HOSTAFORM S 9364 2376

Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.
Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM S 9364 - 2376 - Celanese Corporation
Irving, TX, USA
HOSTAFORM S 9364
2376
HOSTAFORM S 9364 2376
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying to prevent splay and odor problems.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2376
Product Name HOSTAFORM S 9364
Type ExtrusionGrade; MoldingCompound; Thermoplastic
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