Celanese Corporation HOSTAFORM TF-10XAP® 2311

Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.
  • HOSTAFORM TF-10XAP® - 2311 - Celanese Corporation
    Celanese Corporation
Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Suppliers

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Product
Description
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HOSTAFORM TF-10XAP® - 2311 - Celanese Corporation
Celanese Corporation
Irving, TX, USA
HOSTAFORM TF-10XAP®
2311
HOSTAFORM TF-10XAP® 2311
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2311
Product Name HOSTAFORM TF-10XAP®
Type MoldingCompound; Thermoplastic
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