Celanese Corporation HOSTAFORM TF-10XAP® 2311

Description

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Celanese Corporation

Description

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Suppliers

Company

Product

Description

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Celanese Corporation

Irving, TX, USA

HOSTAFORM TF-10XAP®
2311

HOSTAFORM TF-10XAP® 2311

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is recommended.

Supplier's Site

Technical Specifications

	Celanese Corporation
Product Category	Polymers and Plastic Resins
Product Number	2311
Product Name	HOSTAFORM TF-10XAP®
Type	MoldingCompound; Thermoplastic

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