Celanese Corporation HOSTAFORM MT12U01 1990

Description
Drying is not normally required. If material has come in contact with moisture through improper storage or handling, drying may be necessary to prevent splay and odor problems.
Description
Drying is not normally required. If material has come in contact with moisture through improper storage or handling, drying may be necessary to prevent splay and odor problems.

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM MT12U01 - 1990 - Celanese Corporation
Irving, TX, USA
HOSTAFORM MT12U01
1990
HOSTAFORM MT12U01 1990
Drying is not normally required. If material has come in contact with moisture through improper storage or handling, drying may be necessary to prevent splay and odor problems.

Drying is not normally required. If material has come in contact with moisture through improper storage or handling, drying may be necessary to prevent splay and odor problems.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 1990
Product Name HOSTAFORM MT12U01
Type MoldingCompound; Thermoplastic
Unlock Full Specs
to access all available technical data

Similar Products

Fluon+ ™ Filled PTFE Compounds - FR 22 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Type MoldingCompound; Thermoplastic
Form / Shape Pellets
Chemical System Fluoropolymer
View Details
Low Viscosity, Flexibilized Two Component Epoxy - EP30FL - Master Bond, Inc.
Specs
Type CastingResin; Optical; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
View Details
POLYPROPYLENE (PP) 20 GLASS FILLED - BLACK PELLETS DualPoly (2 LBS) - APSX, LLC
Specs
Type MoldingCompound; Thermoplastic
Form / Shape Pellets
Chemical System Polypropylene
View Details
Rigid and Castable Absorbers -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type CastingResin; Thermally cured
Chemical System Epoxy; Silicone
Features EMI / RFI Shielding Material
View Details