Broadcom Inc. Embedded - Embedded - System On Chip (SoC) - BCM3383DUIFEBG BCM3383DUIFEBG

Description
Manufacturer: Broadcom Limited Win Source Part Number: 863680-BCM3383DUIFEB G Features: System On Chip (SOC) IC series Package: Tray Part Status: Obsolete Categories: Integrated Circuits (ICs) ECCN: OBSOLETE Popularity: Medium Fake Threat In the Open Market: 54 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected
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Description
Manufacturer: Broadcom Limited Win Source Part Number: 863680-BCM3383DUIFEB G Features: System On Chip (SOC) IC series Package: Tray Part Status: Obsolete Categories: Integrated Circuits (ICs) ECCN: OBSOLETE Popularity: Medium Fake Threat In the Open Market: 54 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - Embedded - System On Chip (SoC) - BCM3383DUIFEBG - 863680-BCM3383DUIFEBG - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - BCM3383DUIFEBG
863680-BCM3383DUIFEBG
Embedded - Embedded - System On Chip (SoC) - BCM3383DUIFEBG 863680-BCM3383DUIFEBG
Manufacturer: Broadcom Limited Win Source Part Number: 863680-BCM3383DUIFEB G Features: System On Chip (SOC) IC series Package: Tray Part Status: Obsolete Categories: Integrated Circuits (ICs) ECCN: OBSOLETE Popularity: Medium Fake Threat In the Open Market: 54 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected

Manufacturer: Broadcom Limited
Win Source Part Number: 863680-BCM3383DUIFEBG
Features: System On Chip (SOC) IC series
Package: Tray
Part Status: Obsolete
Categories: Integrated Circuits (ICs)
ECCN: OBSOLETE
Popularity: Medium
Fake Threat In the Open Market: 54 pct.
Supply and Demand Status: Limited
Quantity per package: 1
MSL Level: 1 (Unlimited)
REACH Status: REACH Unaffected

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Embedded - System On Chip (SoC) - BCM3383DUIFEBG - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
BCM3383DUIFEBG
Embedded - System On Chip (SoC) BCM3383DUIFEBG
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Supplier's Site Datasheet
System On Chip (SoC) - BCM3383DUIFEBG - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
BCM3383DUIFEBG
System On Chip (SoC) BCM3383DUIFEBG
System On Chip (SOC) IC -

System On Chip (SOC) IC -

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Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
BCM3383DUIFEBG
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) BCM3383DUIFEBG
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Supplier's Site

Technical Specifications

  Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 863680-BCM3383DUIFEBG BCM3383DUIFEBG BCM3383DUIFEBG BCM3383DUIFEBG
Product Name Embedded - Embedded - System On Chip (SoC) - BCM3383DUIFEBG Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Package / Case Tray
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