Broadcom Inc. Embedded - System On Chip (SoC) BCM33838MKFEBG-C2C

Description
MODEM DOCSIS 3.0 8X4
Datasheet
Description
MODEM DOCSIS 3.0 8X4
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - System On Chip (SoC) - BCM33838MKFEBG-C2C - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
BCM33838MKFEBG-C2C
Embedded - System On Chip (SoC) BCM33838MKFEBG-C2C
MODEM DOCSIS 3.0 8X4

MODEM DOCSIS 3.0 8X4

Supplier's Site Datasheet
System On Chip (SoC) - BCM33838MKFEBG-C2C - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
BCM33838MKFEBG-C2C
System On Chip (SoC) BCM33838MKFEBG-C2C
System On Chip (SOC) IC -

System On Chip (SOC) IC -

Buy Now

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number BCM33838MKFEBG-C2C BCM33838MKFEBG-C2C
Product Name Embedded - System On Chip (SoC) System On Chip (SoC)
Unlock Full Specs
to access all available technical data

Similar Products

nRF54L15 System-on-Chip -  - Nordic Semiconductor ASA
Nordic Semiconductor ASA
Specs
Processor Core RISC
Interface SPI; UART; High‑speed SPI/UART, 4x SPI/UART/TWI, PDM, I2S, PWM, QDEC
Package / Case QFN52 with 35 GPIOs QFN48 with 31 GPIOs QFN40 with 24 GPIOs
View Details
 - CY8C4126AZI-S423 - Rochester Electronics
Infineon Technologies AG
View Details