Broadcom Inc. Embedded - System On Chip (SoC) BCM33838MKFEBG-B2P

Description
MODEM DOCSIS 3.0 8X4
Datasheet
Description
MODEM DOCSIS 3.0 8X4
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - System On Chip (SoC) - BCM33838MKFEBG-B2P - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
BCM33838MKFEBG-B2P
Embedded - System On Chip (SoC) BCM33838MKFEBG-B2P
MODEM DOCSIS 3.0 8X4

MODEM DOCSIS 3.0 8X4

Supplier's Site Datasheet
System On Chip (SoC) - BCM33838MKFEBG-B2P - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
BCM33838MKFEBG-B2P
System On Chip (SoC) BCM33838MKFEBG-B2P
System On Chip (SOC) IC -

System On Chip (SOC) IC -

Buy Now
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
BCM33838MKFEBG-B2P
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) BCM33838MKFEBG-B2P
MODEM DOCSIS 3.0 8X4

MODEM DOCSIS 3.0 8X4

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number BCM33838MKFEBG-B2P BCM33838MKFEBG-B2P BCM33838MKFEBG-B2P
Product Name Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Unlock Full Specs
to access all available technical data

Similar Products

TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip - TMS320C6670XCYPA2 - Texas Instruments
Specs
Interface I2C
Supply Voltage 1 to 1.8 volts
View Details
System-On-Chips - 8855760P - RS Components, Ltd.
Nordic Semiconductor ASA
Specs
Processor Core Bluetooth Smart
Interface Bluetooth Smart
Package / Case QFN
View Details
System-On-Chips - 2442899 - RS Components, Ltd.
Infineon Technologies AG
Specs
Package / Case TSDSO-24
View Details