Broadcom Inc. Embedded - System On Chip (SoC) BCM3382ZIFEBG

Description
DOCSIS 3.0 DATA MODEM
Datasheet
Description
DOCSIS 3.0 DATA MODEM
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - System On Chip (SoC) - BCM3382ZIFEBG - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
BCM3382ZIFEBG
Embedded - System On Chip (SoC) BCM3382ZIFEBG
DOCSIS 3.0 DATA MODEM

DOCSIS 3.0 DATA MODEM

Supplier's Site Datasheet
System On Chip (SoC) - BCM3382ZIFEBG - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
BCM3382ZIFEBG
System On Chip (SoC) BCM3382ZIFEBG
System On Chip (SOC) IC *

System On Chip (SOC) IC *

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Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number BCM3382ZIFEBG BCM3382ZIFEBG
Product Name Embedded - System On Chip (SoC) System On Chip (SoC)
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Specs
Processor Core ARM
Clock Frequency 1200 to 1400 MHz
Operating Temperature -40 to 212 F (-40 to 100 C)
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