Broadcom Inc. Embedded - System On Chip (SoC) BCM3380MKFEBG

Description
DOCSIS 3.0 STB FRONT END
Datasheet
Description
DOCSIS 3.0 STB FRONT END
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - System On Chip (SoC) - BCM3380MKFEBG - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
BCM3380MKFEBG
Embedded - System On Chip (SoC) BCM3380MKFEBG
DOCSIS 3.0 STB FRONT END

DOCSIS 3.0 STB FRONT END

Supplier's Site Datasheet
System On Chip (SoC) - BCM3380MKFEBG - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
BCM3380MKFEBG
System On Chip (SoC) BCM3380MKFEBG
System On Chip (SOC) IC *

System On Chip (SOC) IC *

Buy Now

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number BCM3380MKFEBG BCM3380MKFEBG
Product Name Embedded - System On Chip (SoC) System On Chip (SoC)
Unlock Full Specs
to access all available technical data

Similar Products

66AK2E02 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) - 66AK2E02ABDA4 - Texas Instruments
Specs
Processor Core ARM
Interface I2C; SPI; UART; USB
Clock Frequency 1250 to 1400 MHz
View Details
System-On-Chips - 8855760P - RS Components, Ltd.
Nordic Semiconductor ASA
Specs
Processor Core Bluetooth Smart
Interface Bluetooth Smart
Package / Case QFN
View Details