Boyd Mounting Pad; Thickness Boyd 7717-7NG

Description
MOUNTING PAD; Thickness:3.18mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:-; External Width:-; Product Range:-; Body Material:Nylon; Diameter:6.35mm RoHS Compliant: Yes
Datasheet
Description
MOUNTING PAD; Thickness:3.18mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:-; External Width:-; Product Range:-; Body Material:Nylon; Diameter:6.35mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Mounting Pad; Thickness Boyd - 18M8264 - Newark, An Avnet Company
Chicago, IL, United States
Mounting Pad; Thickness Boyd
18M8264
Mounting Pad; Thickness Boyd 18M8264
MOUNTING PAD; Thickness:3.18mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:-; External Width:-; Product Range:-; Body Material:Nylon; Diameter:6.35mm RoHS Compliant: Yes

MOUNTING PAD; Thickness:3.18mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:-; External Width:-; Product Range:-; Body Material:Nylon; Diameter:6.35mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18M8264
Product Name Mounting Pad; Thickness Boyd
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Potting Compound Solutions for PCBAs - Electrolube ® UR5044 Soft / Digoutable, Flame Retardant Polyurethane Resin - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Polyurethane
Industry Electronics; Semiconductors, IC's
View Details
Thermal silicone pad for CPU heat conduction - SF500 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details