Boyd Insulator, Alum Oxide Ceramic, To-220; Insulator Body Material Boyd 4171G

Description
INSULATOR, ALUM OXIDE CERAMIC, TO-220; Insulator Body Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:1.778mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet
Description
INSULATOR, ALUM OXIDE CERAMIC, TO-220; Insulator Body Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:1.778mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator, Alum Oxide Ceramic, To-220; Insulator Body Material Boyd - 10M5995 - Newark, An Avnet Company
Chicago, IL, United States
Insulator, Alum Oxide Ceramic, To-220; Insulator Body Material Boyd
10M5995
Insulator, Alum Oxide Ceramic, To-220; Insulator Body Material Boyd 10M5995
INSULATOR, ALUM OXIDE CERAMIC, TO-220; Insulator Body Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:1.778mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

INSULATOR, ALUM OXIDE CERAMIC, TO-220; Insulator Body Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:1.778mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 10M5995
Product Name Insulator, Alum Oxide Ceramic, To-220; Insulator Body Material Boyd
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thermal Paste for Electronics - Electrolube ® HTC Non-Silicone Thermal Interface Material - MacDermid Alpha Electronics Solutions
Specs
Form / Shape Powder; Grease, Paste
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
Silicone-Free Thermal Gel Series - AE20-LT - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details