Bob Smith Industries, Inc. Maxi-Cure 1/2 Oz. Bob Smith Industries 111

Description
MAXI-CURE 1/2 OZ.
Description
MAXI-CURE 1/2 OZ.

Suppliers

Company
Product
Description
Supplier Links
Maxi-Cure 1/2 Oz. Bob Smith Industries - 88AH7498 - Newark, An Avnet Company
Chicago, IL, United States
Maxi-Cure 1/2 Oz. Bob Smith Industries
88AH7498
Maxi-Cure 1/2 Oz. Bob Smith Industries 88AH7498
MAXI-CURE 1/2 OZ.

MAXI-CURE 1/2 OZ.

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Industrial Adhesives
Product Number 88AH7498
Product Name Maxi-Cure 1/2 Oz. Bob Smith Industries
Unlock Full Specs
to access all available technical data

Similar Products

High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices - CSF20 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Dymax Multi-Cure 9001-E-V3.1 UV Curing Encapsulant Clear 10 mL MR Syringe - 9001-E-V3.1 10ML MR SYR - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Features Encapsulant, Potting Compound
Viscosity 4500 cP
View Details
Electronics Adhesives and Encapsulants - ALPHA ® HiTech ® SM42-120P Adhesive - MacDermid Alpha Electronics Solutions
Specs
Industry Electronics; Semiconductors, IC's
View Details