1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.
1.3 This specification is not intended for electrodeposited copper when used for electroforming.
| ASTM International | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | ASTM B734-97 |
| Product Name | Standard Specification for Electrodeposited Copper for Engineering Uses |
