ASME Standards and Certification Essentials of Electronic Packaging

Description
For the eBook edition, go to: http://ebooks.asmedi gitalcollection.asme .org/book.aspx?booki d=322 By Puligandla Viswanadham Electronic Packaging Book Series Editor: Dereje Agonafer This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates b) various types of components and packages c) materials and processes d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends. Click here to view the table of contents. Available in hardcover.
Description
For the eBook edition, go to: http://ebooks.asmedi gitalcollection.asme .org/book.aspx?booki d=322 By Puligandla Viswanadham Electronic Packaging Book Series Editor: Dereje Agonafer This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates b) various types of components and packages c) materials and processes d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends. Click here to view the table of contents. Available in hardcover.

Suppliers

Company
Product
Description
Supplier Links
Essentials of Electronic Packaging -  - ASME Standards and Certification
New York, NY, USA
Essentials of Electronic Packaging
Essentials of Electronic Packaging
For the eBook edition, go to: http://ebooks.asmedi gitalcollection.asme .org/book.aspx?booki d=322 By Puligandla Viswanadham Electronic Packaging Book Series Editor: Dereje Agonafer This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates b) various types of components and packages c) materials and processes d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends. Click here to view the table of contents. Available in hardcover.

For the eBook edition, go to: http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=322
By Puligandla Viswanadham
Electronic Packaging Book Series Editor: Dereje Agonafer

This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as:

a) printed wiring boards and laminates
b) various types of components and packages
c) materials and processes
d) fundamentals of reliability and relevant reliability enhancement methods, and
e) typical failures observed are described.

A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.

Click here to view the table of contents.
Available in hardcover.

Supplier's Site

Technical Specifications

  ASME Standards and Certification
Product Category Technical Books
Product Name Essentials of Electronic Packaging
Unlock Full Specs
to access all available technical data

Similar Products