Richardson RFPD RF & MW Amplifier Evaluation Board/Designer Kit EV1HMC8205BF10

Description
The EV1HMC8205BF10 evaluation board is a two layer PCB fabricated using 10 mil thick Rogers 4350B copper clad. The PCB is mounted to a copper heat spreader which assists in providing thermal relief to the part as well as mechanical support to the PCB. Mounting holes allow for easy attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces have a 50 Ohm characteristic impedance. The board is populated with components suitable for use over the entire Operating Temperature range of the part. Please refer to the HMC8205 data sheet for information regarding DC connections, biasing, and typical performance.
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Description
The EV1HMC8205BF10 evaluation board is a two layer PCB fabricated using 10 mil thick Rogers 4350B copper clad. The PCB is mounted to a copper heat spreader which assists in providing thermal relief to the part as well as mechanical support to the PCB. Mounting holes allow for easy attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces have a 50 Ohm characteristic impedance. The board is populated with components suitable for use over the entire Operating Temperature range of the part. Please refer to the HMC8205 data sheet for information regarding DC connections, biasing, and typical performance.
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Suppliers

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Product
Description
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RF & MW Amplifier Evaluation Board/Designer Kit - EV1HMC8205BF10 - Richardson RFPD
Downers Grove, IL, United States
RF & MW Amplifier Evaluation Board/Designer Kit
EV1HMC8205BF10
RF & MW Amplifier Evaluation Board/Designer Kit EV1HMC8205BF10
The EV1HMC8205BF10 evaluation board is a two layer PCB fabricated using 10 mil thick Rogers 4350B copper clad. The PCB is mounted to a copper heat spreader which assists in providing thermal relief to the part as well as mechanical support to the PCB. Mounting holes allow for easy attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces have a 50 Ohm characteristic impedance. The board is populated with components suitable for use over the entire Operating Temperature range of the part. Please refer to the HMC8205 data sheet for information regarding DC connections, biasing, and typical performance.

The EV1HMC8205BF10 evaluation board is a two layer PCB fabricated using 10 mil thick Rogers 4350B copper clad. The PCB is mounted to a copper heat spreader which assists in providing thermal relief to the part as well as mechanical support to the PCB. Mounting holes allow for easy attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces have a 50 Ohm characteristic impedance. The board is populated with components suitable for use over the entire Operating Temperature range of the part. Please refer to the HMC8205 data sheet for information regarding DC connections, biasing, and typical performance.

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Electronic Development Boards
Product Number EV1HMC8205BF10
Product Name RF & MW Amplifier Evaluation Board/Designer Kit
Category Developement Board; Development Suite / Kit
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