The AD7819 is a high speed, microprocessor-compa
tible, 8-bit analog-to-digital converter with a maximum throughput of 200 kSPS. The converter operates off a single +2.7 V to +5.5 V supply and contains a 4.5 µs successive approximation A/D converter, track/hold circuitry, on-chip clock oscillator and 8-bit wide parallel interface. The parallel interface is designed to allow easy interfacing to microprocessors and DSPs. Using only address decoding logic the AD7819 is easily mapped into the microprocessor address space.When used in its power-down mode, the AD7819 automatically powers down at the end of a conversion and powers up at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7819 can also operate in a high speed mode where the part is not powered down between conversions. In this mode of operation the part is capable of providing 200 kSPS throughput.The part is available in a small, 16-pin 0.3"" wide, plastic dual-in-line package (DIP); in a 16-pin, 0.15"" wide, narrow body small outline IC (SOIC) and in a 16-pin, narrow body, thin shrink small outline package (TSSOP).
The AD7819 is a high speed, microprocessor-compatible, 8-bit analog-to-digital converter with a maximum throughput of 200 kSPS. The converter operates off a single +2.7 V to +5.5 V supply and contains a 4.5 µs successive approximation A/D converter, track/hold circuitry, on-chip clock oscillator and 8-bit wide parallel interface. The parallel interface is designed to allow easy interfacing to microprocessors and DSPs. Using only address decoding logic the AD7819 is easily mapped into the microprocessor address space.When used in its power-down mode, the AD7819 automatically powers down at the end of a conversion and powers up at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7819 can also operate in a high speed mode where the part is not powered down between conversions. In this mode of operation the part is capable of providing 200 kSPS throughput.The part is available in a small, 16-pin 0.3"" wide, plastic dual-in-line package (DIP); in a 16-pin, 0.15"" wide, narrow body small outline IC (SOIC) and in a 16-pin, narrow body, thin shrink small outline package (TSSOP).
