Arcol Resistors Ltd. Thermal Pads HS300-TP2

Description
HS300 RESISTOR THERMAL PAD
Request a Quote
Description
HS300 RESISTOR THERMAL PAD
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermal Pads - 2275394 - RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Pads
2275394
Thermal Pads 2275394
HS300 RESISTOR THERMAL PAD

HS300 RESISTOR THERMAL PAD

Supplier's Site
Thermal Pads - 2275395 - RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Pads
2275395
Thermal Pads 2275395
HS300 RESISTOR THERMAL PAD

HS300 RESISTOR THERMAL PAD

Supplier's Site

Technical Specifications

  RS Components, Ltd.
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 2275394
Product Name Thermal Pads
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Two Component Thermally Conductive Epoxy System - EP21TDCANHT - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Potting Compound Solutions for PCBAs - Electrolube ® ER2188 General Purpose Epoxy Compound - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
Customized high quality phase change TIMs - SP205A-60 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -40 to 257 F (-40 to 125 C)
View Details