Amphenol Corporation Headers & Wire Housings G861AB04121T2EU

Description
Wafer 2.54mm Pitch STR DIP,1x4Pin,G/F,NY
Request a Quote
Description
Wafer 2.54mm Pitch STR DIP,1x4Pin,G/F,NY
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - G861AB04121T2EU - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
G861AB04121T2EU
Headers & Wire Housings G861AB04121T2EU
Wafer 2.54mm Pitch STR DIP,1x4Pin,G/F,NY

Wafer 2.54mm Pitch STR DIP,1x4Pin,G/F,NY

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number G861AB04121T2EU
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Micro SIM Card PCB Mount Socket - 80440GIH-061T-121L - Rego Electronics Inc.
Specs
Product Type IC Socket
Features Push-Pull
Number of Contacts 6
View Details
Shorting Plug .250
Specs
RoHS Compliant RoHS Compliant
Contact Plating Gold; Gold Plate
View Details
PCB Headers & Receptacles - 102973-2 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
656 Series SSOP Devices ZIF -  - Sensata Technologies
Sensata Technologies
Specs
Product Type IC Socket
Insulation Resistance 5000 Mohms
Contact Resistance 50 milliohms
View Details