Amphenol Corporation Headers & Wire Housings G861AB03221T2EU

Description
Wafer 2.54mm Pitch STR DIP,1x3Pin,G/F,NY
Request a Quote
Description
Wafer 2.54mm Pitch STR DIP,1x3Pin,G/F,NY
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - G861AB03221T2EU - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
G861AB03221T2EU
Headers & Wire Housings G861AB03221T2EU
Wafer 2.54mm Pitch STR DIP,1x3Pin,G/F,NY

Wafer 2.54mm Pitch STR DIP,1x3Pin,G/F,NY

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number G861AB03221T2EU
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Mini SIM Card PCB Mount Socket - 80440GDH-061T-120L - Rego Electronics Inc.
Specs
Product Type IC Socket
Features Push-Push w/Switch
Number of Contacts 6
View Details
Insulated Tip Jack-Black - 6020 - Keystone Electronics Corp.
Keystone Electronics Corp.
Specs
RoHS Compliant RoHS Compliant
Current Rating 10 amps
Operating Temperature -18 to 60 C (0 to 140 F)
View Details
PCB Headers & Receptacles - 102977-1 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
2 suppliers