Amphenol Corporation Headers & Wire Housings G8232010YBEU

Description
Box Header 2.0mm Pitch STR DIP,2x10Pin,F
Request a Quote
Description
Box Header 2.0mm Pitch STR DIP,2x10Pin,F
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - G8232010YBEU - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
G8232010YBEU
Headers & Wire Housings G8232010YBEU
Box Header 2.0mm Pitch STR DIP,2x10Pin,F

Box Header 2.0mm Pitch STR DIP,2x10Pin,F

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number G8232010YBEU
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

774 Series CSP/FBGA Devices -  - Sensata Technologies
Sensata Technologies
Specs
Product Type IC Socket
Contact Resistance 300 milliohms
Operating Temperature 150 C (302 F)
View Details
Mini SIM Card PCB Mount Socket - 80440GFH-081-117L - Rego Electronics Inc.
Specs
Product Type IC Socket
Features Hinge
Number of Contacts 8
View Details
Conn, Header, 5Pos, 1Row, 2.54Mm, Th Rohs Compliant Amphenol Communications Solutions - 29AK9752 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
View Details
2 suppliers
Elastomeric PCB Connectors - ZEBRA® Connector, FG-S - Fujipoly® America Corp.
Specs
Product Type Elastomeric Connectors
Contact Plating Gold
View Details