Amphenol Corporation BergStik ® 77317-412-20LF

BergStik¬Æ 2.54mm unshrouded headers are designed for versatile interconnect solutions, including Board-to-Board, Wire-to-Board, and Cable-to-Board applications. Available in surface-mount (SMT), through-hole (THT), press-fit, stacking, and pin-in-paste (PIP) configurations, these headers come in single and double row options with a pitch of 2.54mm. They feature a breakaway design, allowing customization to specific lengths, and support a maximum current rating of 3A per contact. Constructed from high-temperature thermoplastic with a UL94V-0 flammability rating, these headers are compatible with various soldering processes, including wave, vapor-phase, and IR reflow. They are specified for up to 100 mating cycles and offer a retention force of 9N minimum. The product is RoHS compliant, ensuring it meets environmental regulations. The insulation resistance is rated at 5000MOc minimum, and the dielectric withstanding voltage is 1500V. Operating temperature ranges from -65¬8C to +125¬8C, making it suitable for a wide array of electronic devices.